MediaTek recently announced its Dimensity 9000 chipset that is the first chipset to use TSMC’s 4nm process technology. However, there are reports that the company is also working on Dimensity 7000 chipset and according to a leak on weibo, Digital Chat Station reveals some info about the Dimensity 7000.
According to him, Dimensity 7000 is going to use TSMC 5nm process technology and will feature an 8 core CPU setup. Four cores will be Performance Cortex-A78 featuring 2.75GHz of clock speed while the other four cores will be Efficient Cortex-A55 that will be clocked at 2.0GHz. The Dimensity 7000 is going to use the Mali G510 GPU which is the successor to the Mali G57 GPU and is said to bring a 100% boost over the latter along with 22% more power efficiency.
Dimensity 7000 looks more of a mid-range chipset compared to the higher-end Dimensity 1100 that comes with a very powerful Mali G77 MP9 GPU. Dimensity 7000 will likely clash with the Qualcomm Snapdragon 778G which is built on TSMC 6nm process and features Adreno 642L GPU.
Other technical specifications of Dimensity 7000 are still unknown and there is no official word on its release from MediaTek.
